Rechercher un projet financé :
2009
SYMPA
SYstEM on Chip for software rAdio - Design of a chip for terminals and multi-standard base stations, reconfigurable, mobile networks of the future.
2008
SMARTSTACK (ex-TRAVIATA)
3D circuit integration (3D IC) whose chip chip connections are provided by vias through silicon.
2008
Vinetag
To develop a solution answering a problem of upstream traceability in the wine field and jointly using several technologies (RFID, geolocation, mobile communication).
2009
OSIRIS
Ultrasound probe card cleaner and selective etching.